Title:
METHOD FOR IMPLANTING ONE-DIMENSIONAL NANO MATERIAL INTO SURFACE OF METAL ELECTRODE
Document Type and Number:
WIPO Patent Application WO/2011/160532
Kind Code:
A1
Abstract:
A method for implanting one-dimensional nano material into surface of metal electrode is provided, which includes: first of all, forming composite material into a composite material thin film, next planarizing its surface, then selectively etching composite thin film to expose part of the one-dimensional nano material, subsequently implanting the exposed one-dimensional nano material into a metal film by surface metallization and thickening process, finally selectively etching the residual portion of the composite thin film, leaving fixed one-dimensional nano material implanted into the metal, thereby implementing the effect of reliably implanting the one-dimensional nano material into the metal base. By depositing high strength metal adhesive layer on the clean surface of the exposed one-dimensional nano material, said method implements reliable combination structure between the one-dimensional nano material and the metal layer, with firm mechanical combination strength and reliable electrical contact.
Inventors:
DING, Gui Fu (No.800 Dongchuan Road, Minhang District, Shanghai 0, 200240, CN)
丁桂甫 (中国上海市闵行区东川路800号, Shanghai 0, 200240, CN)
WANG, Yan (No.800 Dongchuan Road, Minhang District, Shanghai 0, 200240, CN)
王艳 (中国上海市闵行区东川路800号, Shanghai 0, 200240, CN)
WANG, Hong (No.800 Dongchuan Road, Minhang District, Shanghai 0, 200240, CN)
丁桂甫 (中国上海市闵行区东川路800号, Shanghai 0, 200240, CN)
WANG, Yan (No.800 Dongchuan Road, Minhang District, Shanghai 0, 200240, CN)
王艳 (中国上海市闵行区东川路800号, Shanghai 0, 200240, CN)
WANG, Hong (No.800 Dongchuan Road, Minhang District, Shanghai 0, 200240, CN)
Application Number:
CN2011/074838
Publication Date:
December 29, 2011
Filing Date:
May 30, 2011
Export Citation:
Assignee:
SHANGHAI JIAOTONG UNIVERSITY (No.800 DongChuan Road, MinHang District, Shanghai 0, 200240, CN)
上海交通大学 (中国上海市闵行区东川路800号, Shanghai 0, 200240, CN)
DING, Gui Fu (No.800 Dongchuan Road, Minhang District, Shanghai 0, 200240, CN)
丁桂甫 (中国上海市闵行区东川路800号, Shanghai 0, 200240, CN)
WANG, Yan (No.800 Dongchuan Road, Minhang District, Shanghai 0, 200240, CN)
王艳 (中国上海市闵行区东川路800号, Shanghai 0, 200240, CN)
上海交通大学 (中国上海市闵行区东川路800号, Shanghai 0, 200240, CN)
DING, Gui Fu (No.800 Dongchuan Road, Minhang District, Shanghai 0, 200240, CN)
丁桂甫 (中国上海市闵行区东川路800号, Shanghai 0, 200240, CN)
WANG, Yan (No.800 Dongchuan Road, Minhang District, Shanghai 0, 200240, CN)
王艳 (中国上海市闵行区东川路800号, Shanghai 0, 200240, CN)
International Classes:
H01J9/12; C01B31/02
Attorney, Agent or Firm:
SHANGHAI JIAODA PATENT AGENCY (Room230, 3rd Educational Building Patent Office, No.1954 Huashan Roa, Xuhui District Shanghai 0, 200030, CN)
Claims: