Title:
METHOD FOR IMPLEMENTING STACKED CONNECTION OF COMPONENTS OF SEPARATION CIRCUIT AND CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2017/186058
Kind Code:
A1
Abstract:
Disclosed is a method for implementing stacked connection of components of a separation circuit and a circuit. The method provides at least two circuit components for connection in series and/or in parallel for the circuit, wherein corresponding pins of components are directly soldered according to a connection structure of the circuit, such that the components form a composite module according to the manner of connection required by the circuit, eliminating the use of a circuit board and connecting wire. Since modular components and easy-solder soldering plates (110) are disposed on the components, the method and circuit can form a circuit unit only by soldering and joining the components without the need for a PCB circuit board. Design implementation of the method and circuit can be carried out in a three-dimensional space, has a wider design space, and can shorten time from design to manufacture of the circuit.
Inventors:
ZHENG YIPU (CN)
Application Number:
PCT/CN2017/081429
Publication Date:
November 02, 2017
Filing Date:
April 21, 2017
Export Citation:
Assignee:
SHENZHEN XILONG TOY COMPANY LTD (CN)
International Classes:
H01R4/02; H05K13/04
Foreign References:
| CN105789918A | 2016-07-20 | |||
| CN105096711A | 2015-11-25 | |||
| JP2012084390A | 2012-04-26 | |||
| DE20210306U1 | 2002-08-29 | |||
| TW200820857A | 2008-05-01 |
Attorney, Agent or Firm:
JOHNSON INTELLECTUAL PROPERTY AGENCY (SHENZHEN) (CN)
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