Title:
METHOD FOR IMPROVING ADHESION BETWEEN POLYMER FILM AND METAL LAYER
Document Type and Number:
WIPO Patent Application WO/2014/092335
Kind Code:
A1
Abstract:
The present invention relates to a method for improving the adhesion between a polymer substrate and a metal layer formed on said substrate. The method according to the present invention comprises the steps of: (a) conducting surface modification treatment of a polymer film; (b) forming a metal layer on the surface modification treated polymer film; and (c) conducting an aging treatment and/or a current application treatment with respect to the metal layer.
Inventors:
LEE HO-NYUN (KR)
LEE HONG-KEE (KR)
HAN YOON-SUNG (KR)
HUR JIN-YOUNG (KR)
LEE JANG-HUN (KR)
LEE HONG-KEE (KR)
HAN YOON-SUNG (KR)
HUR JIN-YOUNG (KR)
LEE JANG-HUN (KR)
Application Number:
PCT/KR2013/009825
Publication Date:
June 19, 2014
Filing Date:
November 01, 2013
Export Citation:
Assignee:
KOREA IND TECH INST (KR)
International Classes:
H05K3/38; B32B15/08
Domestic Patent References:
| WO2010098235A1 | 2010-09-02 |
Foreign References:
| KR20080030314A | 2008-04-04 | |||
| KR20080030310A | 2008-04-04 | |||
| KR101189133B1 | 2012-10-10 |
Attorney, Agent or Firm:
IAM PATENT FIRM (KR)
특허법인아이엠 (KR)
특허법인아이엠 (KR)
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