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Patent Searching and Data


Title:
METHOD FOR INCREASING ADHESION OF COPPER TO POLYMERIC SURFACES
Document Type and Number:
WIPO Patent Application WO/2015/020725
Kind Code:
A3
Abstract:
Techniques disclosed herein a method and system for conditioning a polymeric layer on a substrate to enable adhesion of a metal layer to the polymeric layer. Techniques may include conditioning the polymeric layer with nitrogen-containing plasma to generate a nitride layer on the surface of the polymeric layer. In another embodiment, the conditioning may include depositing a CuN layer using a lower power copper sputtering process in a nitrogen rich environment. Following the condition process, a higher power copper deposition or sputtering process may be used to deposit copper onto the polymeric layer with good adhesion properties.

Inventors:
SERYOGIN GEORGIY (US)
TETREAULT THOMAS G (US)
GOLOVATO STEPHEN N (US)
CHANDRASEKARAN RAMYA (US)
Application Number:
PCT/US2014/043081
Publication Date:
October 29, 2015
Filing Date:
June 19, 2014
Export Citation:
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Assignee:
TEL NEXX INC (US)
TEL EPION INC (US)
International Classes:
C08F2/52
Foreign References:
US4297187A1981-10-27
US5800859A1998-09-01
US4536271A1985-08-20
US3645772A1972-02-29
Attorney, Agent or Firm:
MEHIGAN, Jason D. (Inc.2400 Grove Boulevar, Austin Texas, US)
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