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Title:
METHOD FOR INDUCING CONDUCTIVITY IN FILMS INCLUDING METAL MICROPARTICLES
Document Type and Number:
WIPO Patent Application WO/2013/115300
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a means with which the sintering temperature and time required to induce conductivity in a variety of metal microparticles can be reduced. This method for inducing conductivity includes a step in which a gas having a water-vapour content of at least 14g/m3 is brought into contact with at least one section of a film including coated metal microparticles which have been provided on a substrate and coated with a protective film including alkylamine.

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Inventors:
KURIHARA MASATO (JP)
TOKITO SHIZUO (JP)
KUMAKI DAISUKE (JP)
Application Number:
PCT/JP2013/052151
Publication Date:
August 08, 2013
Filing Date:
January 31, 2013
Export Citation:
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Assignee:
UNIV YAMAGATA (JP)
International Classes:
H01B13/00; B22F1/054; B22F1/102; B22F9/30; H01B1/00; H01B5/14
Foreign References:
JP2006169613A2006-06-29
JP2010265543A2010-11-25
JP2009270146A2009-11-19
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
Patent business corporation Tsukuni (JP)
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