Title:
METHOD FOR INSPECTING AND REPAIRING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2014/014181
Kind Code:
A1
Abstract:
The present invention relates to a substrate inspection and repair method capable of inspection a defect location through a pattern inspection of a substrate, determining whether a wire has been short circuited or cut at the defect location through image comparison and outputting a signal restoration corresponding to the determined result is carried out such that a defect portion can be automatically restored, and the method comprises: an inspection step of optically inspecting a pattern defect of a substrate and transmitting recorded information on the pattern defect; a reading step of determining whether the pattern defect has a short circuited or cut wire on the basis of the transmitted information on the pattern defect; and a restoration step of performing repair work by recognizing short circuited or cut wire information on the pattern defect.
Inventors:
LIM SSANG-GUN (KR)
KANG MIN-GU (KR)
SONG JUN-HO (KR)
LEE HYUN-MIN (KR)
HAN CHUL-HEE (KR)
KANG MIN-GU (KR)
SONG JUN-HO (KR)
LEE HYUN-MIN (KR)
HAN CHUL-HEE (KR)
Application Number:
PCT/KR2013/002033
Publication Date:
January 23, 2014
Filing Date:
March 14, 2013
Export Citation:
Assignee:
INTEKPLUS CO LTD (KR)
International Classes:
G01N21/88; G02F1/13
Foreign References:
| KR20090111780A | 2009-10-27 | |||
| KR20050059897A | 2005-06-21 | |||
| KR20050041357A | 2005-05-04 | |||
| KR20050030023A | 2005-03-29 | |||
| KR20090107815A | 2009-10-14 |
Attorney, Agent or Firm:
SINJI PATENT FIRM (KR)
특허법인 신지 (KR)
특허법인 신지 (KR)
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