Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD OF JOINING BY WELDING OUTER PANEL/ATTACHMENT OF ROLLING STOCK AND SIDE STRUCTURE MADE THEREBY
Document Type and Number:
WIPO Patent Application WO/2008/068808
Kind Code:
A1
Abstract:
In the joining by welding of outer panel (3) with attachments, such as skeletal members (1,2), open frame and open frame material (42a,43a), for reinforcement or interior exterior finishing thereof, the region where the outer panel (3) and each attachment (1,2,42a,43a) applied thereto are superimposed one upon the other is subjected to laser welding along the polishing line aligned in one direction on the surfaces on the externally exposed side of the outer panel (3) and attachment (1,2,42a,43a). Thus, the joining by welding of the outer panel (3) with the attachment (1,2,42a,43a) is accomplished, thereby realizing an outer panel/attachment welding joined structure that is advantageous in appearance, working efficiency and cost.

Inventors:
HARADA HIROJI
KONO YOSHINORI
SUMIKAWA TOMONORI
YONETANI HIROSHI
TANAKA YASUHIRO
KATO EIICHI
Application Number:
PCT/JP2006/323984
Publication Date:
June 12, 2008
Filing Date:
November 30, 2006
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KINKI SHARYO KK (JP)
HARADA HIROJI
KONO YOSHINORI
SUMIKAWA TOMONORI
YONETANI HIROSHI
TANAKA YASUHIRO
KATO EIICHI
International Classes:
B61D17/00; B23K9/00; B23K9/02; B23K11/00; B23K26/20; B61D17/08
Domestic Patent References:
WO2005007076A22005-01-27
Foreign References:
JP2006341300A2006-12-21
JPS639481Y21988-03-22
JP2003311443A2003-11-05
JP2002103074A2002-04-09
JPH11278258A1999-10-12
JPS5929355U1984-02-23
Attorney, Agent or Firm:
ISHIHARA, Masaru (Tatsuno Nishi-tenma Bldg.1-6, Nishi-tenma 3-chome,Kita-k, Osaka-shi Osaka 47, JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: SEMICONDUCTOR DEVICE FABRICATING METHOD AND SEMICONDUCTOR DEVICE

Next Patent: HIGH FREQUENCY AMPLIFIER