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Title:
METHOD FOR JOINING DISSIMILAR METALS, AND LASER WELDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/026614
Kind Code:
A1
Abstract:
This method for joining dissimilar metals involves joining an Al-based parent material (2) comprising an Al alloy or pure Al and a Cu-based parent material (3) comprising a Cu alloy or pure Cu, wherein a welding material (5) comprising an Al alloy that contains Si and/or Cu is used to join the Al-based parent material (2) and the Cu-based parent material (3) through laser welding in which an irradiated portion that is irradiated by laser light is melted and solidified.

Inventors:
YOMOGIDA Shohei (1-7-2 Otemachi, Chiyoda-k, Tokyo 04, 〒1000004, JP)
MURASE Takashi (1-7-2 Otemachi, Chiyoda-k, Tokyo 04, 〒1000004, JP)
FUKUDA Toshihiko (1-7-2 Otemachi, Chiyoda-k, Tokyo 04, 〒1000004, JP)
Application Number:
JP2018/026821
Publication Date:
February 07, 2019
Filing Date:
July 18, 2018
Export Citation:
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Assignee:
UACJ CORPORATION (1-7-2, Otemachi Chiyoda-k, Tokyo 04, 〒1000004, JP)
International Classes:
B23K26/323; B23K26/211
Domestic Patent References:
WO2012153590A12012-11-15
Foreign References:
JP2012138306A2012-07-19
JP2014135204A2014-07-24
JPH1190632A1999-04-06
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (Sonderhoff & Einsel Law and Patent Office, Shin-Marunouchi Center Building 6-2, Marunouchi 1-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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