METHOD OF JOINING AND JOINED BODY

WIPO Patent Application WO/2005/095040

A1

It is intended to, even when members to be joined are constituted of a material having a surface susceptible to oxidation, a metal of little atomic diffusion or a nonmetallic material, attain joining of members to be joined with, for example, satisfactory junction strength so as to provide a substitute for high-temperature soldering. Joining material (34) comprising composite metal nanoparticles composed of metal nuclei of metal nanoparticles (10) having the periphery thereof coated with and protected by organic substance (14) is provided. Metal material (32) with property such that the surface thereof is resistant to oxidation even when exposed to high temperature in atmospheric air is fixed to surfaces to be joined (30a) of members to be joined (30). While causing the joining material (34) to be brought into contact with and interposed between the surfaces to be joined (30a) of members to be joined (30), the metal nanoparticles are sintered.

JP2007038298	LIQUID PHASE DIFFUSION BONDING OF DISSIMILAR METALS
JP2642828	[Title of Invention] Reinforced soft metal product

OGURE NAOAKI (JP)
CHIKAMORI YUSUKE (JP)
KOBAYASHI KOJIRO (JP)
HIROSE AKIO (JP)

PCT/JP2005/006689

October 13, 2005

March 30, 2005

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EBARA CORP (JP)
OGURE NAOAKI (JP)
CHIKAMORI YUSUKE (JP)
KOBAYASHI KOJIRO (JP)
HIROSE AKIO (JP)

B23K20/00; B23K35/02; (IPC1-7): B23K20/00

WO2004026526A1

2004-04-01

JP2001048511A	2001-02-20
JP2001168060A	2001-06-22

IDE H. ET AL.: "Gin Nano Ryushi o Mochiita Setsugo Process -Cu tono Setsugo no Kento-.", DAI 10 KAI ELECTRONICS NI OKERU MICRO SETSUGO JISSO GIJUTSU SYMPOSIUM RONBUNSHU, vol. 10, 5 February 2004 (2004-02-05), XP002994266

Watanabe, Isamu (5-8 Nishi-Shinjuku 7-chom, Shinjuku-ku Tokyo 23, JP)

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