Title:
METHOD FOR JOINING SUPERHARD MATERIALS USING METAL PLATING FILM HAVING AMORPHOUS AND HEATING CHARACTERISTICS
Document Type and Number:
WIPO Patent Application WO/2017/022991
Kind Code:
A1
Abstract:
The present invention relates to a method for joining superhard materials, the method comprising: a step for preparing an aqueous alloy plating solution comprising at least two kinds of metal salts including a first metal salt and a second metal salt; a step for dipping an electrode in the aqueous alloy plating solution, thereby configuring an electroplating circuit; a step for inputting a voltage between +2V and -4.5V with reference to a standard hydrogen electrode at 25ºC, or a current value corresponding thereto, to a control unit, which controls the electroplating circuit, according to the reduction potential value of the metal salt to be plated, thereby applying the reduction potential or current to the electrode; a step for forming a multilayered amorphous metal plating film, which comprises at least two layers, on a surface of a first superhard material or of a second superhard material, on a surface of the first superhard material and on a surface of the second superhard material, or on both surfaces of a core metal that is to be arranged between the first superhard material and the second superhard material, by means of the difference in standard reduction potential between the metal salts; and a joining step for arranging the first superhard material and the second superhard material such that the multilayered amorphous metal plating film is arranged between the first superhard material and the second superhard material and faces the same, or arranging the core metal between the first superhard material and the second superhard material, and then pressurizing and joining the first superhard material and the second superhard material against each other, while heating the same in a melting temperature range, such that the multilayered amorphous metal plating film exhibits heating characteristics. The present invention is advantageous in that superhard materials, tool steel, etc. are joined by forming a metal plating film between the superhard materials, thereby making it possible to form a joining portion that exhibits an excellent joining strength even at a relatively low joining temperature, and to join superhard materials by an easy method.
Inventors:
JUNG JAE PIL (KR)
LEE JUN HYEONG (KR)
JUNG DO HYUN (KR)
LIM DONG UK (KR)
LEE JUN HYEONG (KR)
JUNG DO HYUN (KR)
LIM DONG UK (KR)
Application Number:
PCT/KR2016/008065
Publication Date:
February 09, 2017
Filing Date:
July 22, 2016
Export Citation:
Assignee:
DUKSAN HIGH METAL CO LTD (KR)
International Classes:
B23K20/02; B23K20/00; B23K20/04; B23K20/16; B23K35/02; B23K35/40; C25D3/02; C25D3/04; C25D7/06
Foreign References:
| KR20110128859A | 2011-11-30 | |||
| KR20030028691A | 2003-04-10 | |||
| JP2012210639A | 2012-11-01 | |||
| KR930009665B1 | 1993-10-08 | |||
| KR20010017892A | 2001-03-05 |
Other References:
LEE, JUN HYEONG: "Fabrication of Metal Nano Layers by Electroplating and Low Temperature Soldering for 3-Dimensional Packaging", THESIS FOR MASTER OF SCIENCE AND ENGINEERING, August 2014 (2014-08-01)
Attorney, Agent or Firm:
TW INTERNATIONAL PATENT AND LAW FIRM (KR)
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