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Patent Searching and Data


Title:
METHOD FOR JOINING TRANSPARENT SUBSTRATES, AND LAMINATED BODY
Document Type and Number:
WIPO Patent Application WO/2020/111015
Kind Code:
A1
Abstract:
Provided is a method for joining transparent substrates, the method comprising: preparing a pair of transparent substrates; forming aluminum oxide thin films on joint surfaces of the transparent substrates by sputtering; joining the pair of transparent substrates by bringing the aluminum oxide thin films into contact with air; and heating the pair of joined transparent substrates.

Inventors:
SUGA TADATOMO (JP)
MATSUMOTO YOSHIIE (JP)
Application Number:
PCT/JP2019/046041
Publication Date:
June 04, 2020
Filing Date:
November 25, 2019
Export Citation:
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Assignee:
LAN TECHNICAL SERVICE CO LTD (JP)
SUGA TADATOMO (JP)
International Classes:
H05B33/04; C23C14/08; H01L51/50; H05B33/10
Domestic Patent References:
WO2015125770A12015-08-27
WO2015146305A12015-10-01
WO2019131490A12019-07-04
Foreign References:
JP2014123514A2014-07-03
JPH07246342A1995-09-26
JP2004327402A2004-11-18
JP2015141738A2015-08-03
JP2008207221A2008-09-11
Other References:
See also references of EP 3890442A4
Attorney, Agent or Firm:
AKATSU Takeshi (JP)
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