Title:
METHOD FOR LASER BONDING
Document Type and Number:
WIPO Patent Application WO/2012/140873
Kind Code:
A1
Abstract:
A method for laser bonding is provided in which interfacial strength between two thermoplastic resins or between a resin and a metal is heightened to render tenacious bonding possible, and bonding failures due to a remaining space can be significantly diminished. In order to solve the problem, the method includes, before bonding, a step in which the bonding surface of at least a first thermoplastic resin is subjected to a surface modification treatment to thereby form an oxidized layer that contains a larger number of oxygenic functional groups than in the bulk thermoplastic resin. A liquid intermediate material is interposed between the first thermoplastic resin and a second thermoplastic resin or a metal, and the stack in this state is pressed and bonded by laser irradiation.
Inventors:
ARAI SATOSHI (JP)
HYUGANO TAKESHI (JP)
HYUGANO TAKESHI (JP)
Application Number:
PCT/JP2012/002496
Publication Date:
October 18, 2012
Filing Date:
April 11, 2012
Export Citation:
Assignee:
HITACHI LTD (JP)
ARAI SATOSHI (JP)
HYUGANO TAKESHI (JP)
ARAI SATOSHI (JP)
HYUGANO TAKESHI (JP)
International Classes:
B29C65/16; B23K26/21; B23K26/32
Foreign References:
| JP2005104132A | 2005-04-21 | |||
| JP2005070245A | 2005-03-17 | |||
| JP2006015405A | 2006-01-19 | |||
| JP2009039987A | 2009-02-26 | |||
| JP2009096527A | 2009-05-07 | |||
| JPH0569486A | 1993-03-23 | |||
| JP2002067164A | 2002-03-05 | |||
| JP2009012355A | 2009-01-22 | |||
| JPS6246621A | 1987-02-28 | |||
| JP2005081771A | 2005-03-31 |
Attorney, Agent or Firm:
INOUE, Manabu et al. (JP)
Manabu Inoue (JP)
Manabu Inoue (JP)
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Claims:
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