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Patent Searching and Data


Title:
METHOD FOR LASER CUTTING FLAT WORKPIECES AND RELATED COMPUTER PROGRAM PRODUCT
Document Type and Number:
WIPO Patent Application WO/2019/025327
Kind Code:
A3
Abstract:
The invention relates to a method for laser cutting an in particular flat workpiece (6) along a curve (K) by means of a laser beam (5). In order to produce a microjoint (14) which has a lower height (d) than the workpiece thickness (d) and does not lie at the end of the curve (K), during laser cutting the workpiece (6), the laser power of the laser beam (5) on a segment of the curve (K) which corresponds to the length (L) of the microjoint (14) is reduced from a higher laser power (PA) sufficient to cut through the workpiece (6) to a lower laser power (PS) insufficient to completely cut through the workpiece (6) and is then increased back to the higher laser power, the time for the power drop (-∆P) from the higher to the lower laser power being different from that for the power increase (+∆P) from the lower to the higher laser power.

Inventors:
MACH PATRICK (DE)
BIRK MARCEL (DE)
BEA MARTIN (DE)
KAISER TOBIAS (DE)
ROMINGER VOLKER (DE)
Application Number:
PCT/EP2018/070494
Publication Date:
April 11, 2019
Filing Date:
July 27, 2018
Export Citation:
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Assignee:
TRUMPF WERKZEUGMASCHINEN GMBH CO KG (DE)
International Classes:
B23K26/38
Foreign References:
JP2005014009A2005-01-20
JPH06190576A1994-07-12
JP2011083788A2011-04-28
JP2001334379A2001-12-04
DE102012212566A12014-01-23
DE102014209811A12015-11-26
JPH04231192A1992-08-20
Other References:
THOMAS HIMMER: "Hochwertig schneiden mit CO2- und Faserlasern", BLECH INFORM, no. 3/2007, 31 December 2007 (2007-12-31), pages 50 - 53, XP055523948
Attorney, Agent or Firm:
TRUMPF PATENTABTEILUNG (DE)
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