Title:
METHOD OF LOADING A WAFER ONTO A WAFER HOLDER TO REDUCE THERMAL SHOCK
Document Type and Number:
WIPO Patent Application WO2003088326
Kind Code:
A3
Abstract:
One or more of three different measures are taken to preheat a wafer (44) before it is loaded into direct contact with a wafer holder (42), in order to provide optimal throughput while reducing the risk of thermal shock to the wafer (44). The first measure is to move the wafer holder (42) to a raised position prior to inserting the wafer (44) into the reaction chamber (20) and holding the wafer (44) above the wafer holder (42). The second measure is to provide an increased flow rate of a heat-conductive gas (such as Hs purge gas) through the chamber (20) prior to inserting the wafer (44) therein. The third measure is to provide a power bias to radiative heat elements (e.g., heat lamps) (51) above the reaction chamber (20).
Inventors:
KEETON TONY J
STAMP MICHAEL R
HAWKINS MARK R
STAMP MICHAEL R
HAWKINS MARK R
Application Number:
PCT/US2003/009806
Publication Date:
March 24, 2005
Filing Date:
March 27, 2003
Export Citation:
Assignee:
ASM INC (US)
International Classes:
B65G49/07; C23C16/46; H01L21/00; H01L21/677; H01L21/683; (IPC1-7): H01L21/00
Foreign References:
| US6290491B1 | 2001-09-18 | |||
| US6215106B1 | 2001-04-10 | |||
| US20020155669A1 | 2002-10-24 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 007, no. 251 (E - 209) 8 November 1983 (1983-11-08)
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