Title:
METHOD FOR LOW-TEMPERATURE JOINING OF METAL MATERIALS, AND JOINT STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/154658
Kind Code:
A1
Abstract:
[Problem] To provide: an easy-to-use low-temperature joining method with which it is possible to effectively suppress reductions in the mechanical properties of a junction of various types of high-tensile steel or aluminum, and of a heat-affected zone; and a joint structure obtained from the low-temperature joining method. [Solution] A method for joining two metal materials by forming a joint interface in which the two metal materials face each other at a joint and press-fitting to the joint a rotation tool caused to rotate at a prescribed speed, the method for low-temperature joining of metal materials characterized in that the peripheral velocity of the outermost periphery of the rotation tool is set to 51 mm/s or less, whereby the re-crystallization temperature inherent to the metal materials is reduced by introducing a large strain to the joint, and recrystallized grains are generated at the joint interface by setting the joining temperature to less than the re-crystallization temperature inherent to the metal materials.
Inventors:
FUJII HIDETOSHI (JP)
UEJI RINTARO (JP)
MORISADA YOSHIAKI (JP)
UEJI RINTARO (JP)
MORISADA YOSHIAKI (JP)
Application Number:
PCT/JP2017/007677
Publication Date:
September 14, 2017
Filing Date:
February 28, 2017
Export Citation:
Assignee:
OSAKA UNIVERSTIY (JP)
International Classes:
B23K20/12
Foreign References:
| JP5255781B2 | 2013-08-07 | |||
| JP2012040584A | 2012-03-01 |
Attorney, Agent or Firm:
NAKA Koichi (JP)
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