Title:
METHOD FOR LOWERING BONDING STRENGTH OF ADHESIVE LAYER
Document Type and Number:
WIPO Patent Application WO/2023/136299
Kind Code:
A1
Abstract:
The present invention provides: a method in which electrical pulses are applied to an article including a portion where two or more members have been bonded together by an adhesive layer containing an electroconductive filler, thereby lowering the bonding strength of the adhesive layer; and a method in which a member is taken out of the article using said method and the member or a functional component contained in the member is reused.
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Inventors:
TOKORO CHIHARU (JP)
INUTSUKA MANABU (JP)
LIM SOOWON (JP)
KOITA TAKETOSHI (JP)
KONDO MASATAKA (JP)
OGAWA RYO (JP)
OTA KEISUKE (JP)
INUTSUKA MANABU (JP)
LIM SOOWON (JP)
KOITA TAKETOSHI (JP)
KONDO MASATAKA (JP)
OGAWA RYO (JP)
OTA KEISUKE (JP)
Application Number:
PCT/JP2023/000630
Publication Date:
July 20, 2023
Filing Date:
January 12, 2023
Export Citation:
Assignee:
UNIV WASEDA (JP)
ADEKA CORP (JP)
ADEKA CORP (JP)
International Classes:
B09B5/00; B02C19/18; C09J9/02; C09J11/00; C09J201/00; H01B1/00; H01B1/20
Domestic Patent References:
| WO2021153383A1 | 2021-08-05 | |||
| WO2020235573A1 | 2020-11-26 |
Foreign References:
| JP2020069454A | 2020-05-07 | |||
| JP2021023839A | 2021-02-22 | |||
| JP2012517892A | 2012-08-09 | |||
| JP2017104796A | 2017-06-15 | |||
| JP2016068020A | 2016-05-09 | |||
| JP2017136516A | 2017-08-10 | |||
| JP2010059385A | 2010-03-18 |
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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