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Title:
METHOD FOR MACHINING SPUTTERING TARGET, DEVICE FOR MACHINING SPUTTERING TARGET, SPUTTERING TARGET, AND METHOD FOR MANUFACTURING SPUTTERING TARGET PRODUCT
Document Type and Number:
WIPO Patent Application WO/2018/151037
Kind Code:
A1
Abstract:
A method for machining a sputtering target including a sputtering surface, a facing surface on the opposite side from the sputtering surface, and an outer peripheral surface between the sputtering surface and the facing surface, the method for machining a sputtering target comprising: a step for mounting the sputtering surface or the facing surface of the sputtering target in a fixing platform, and fixing the sputtering target to the fixing platform; and a step for cutting the outer peripheral surface of the sputtering target using a cutting tool while rotating the cutting tool in the peripheral direction of the outer peripheral surface of the sputtering target.

Inventors:
FUJITA MASAHIRO (JP)
NISHIOKA KOJI (JP)
Application Number:
PCT/JP2018/004579
Publication Date:
August 23, 2018
Filing Date:
February 09, 2018
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C23C14/34; B23C3/13; B23Q3/08
Foreign References:
JP2009127125A2009-06-11
JPS63200955A1988-08-19
JP2011132557A2011-07-07
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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