Title:
METHOD OF MACHINING WORK
Document Type and Number:
WIPO Patent Application WO/2008/013134
Kind Code:
A1
Abstract:
A surface-machining device for finishing the surface of a work such as a wafer
and a cylinder inner surface to a mirror surface and a method of machining a work,
which process the surface of a substrate with high machining efficiency and high
precision. A method of machining a work for machining the surface of a wafer, a
cylinder inner surface or the like as a work by using a cutting tool, wherein surface-machining
is performed at a speed such that a cutting tool machining speed v satisfies v≥c2
when the machining speed of the cutting tool with respect to the surface of a substrate
is v and the transverse wave propagation speed of compression stress wave of a
component material constituting the work is c2. It is preferable that
the kinetic energy of the cutting tool before hitting the work is larger than a
total of energy for shearing interatomic bonding elements of a material constituting
the work, kinetic energy of the shaved off work moving together with the cutting
tool and kinetic energy of the cutting tool moving at a speed at least a transverse
wave propagation speed.
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Inventors:
OTSUKA, Kanji (2-1074-38, Kohan Higashiyamato-sh, Tokyo 02, 2070002, JP)
Application Number:
JP2007/064420
Publication Date:
January 31, 2008
Filing Date:
July 23, 2007
Export Citation:
Assignee:
TAMA-TLO Ltd. (HACHIOJI SQUARE BLDG. 11F, 9-1 ASAHI-CHOHACHIOJI-SHI, Tokyo 83, 1920083, JP)
タマティーエルオー株式会社 (〒83 東京都八王子市旭町９番１号 八王子スクエアビル１１階 Tokyo, 1920083, JP)
タマティーエルオー株式会社 (〒83 東京都八王子市旭町９番１号 八王子スクエアビル１１階 Tokyo, 1920083, JP)
International Classes:
B23C3/00; B23B1/00; B23C5/16; B24B1/00; H01L21/304; B23C3/00; B23B1/00; B23C5/16; B24B1/00; H01L21/02
Attorney, Agent or Firm:
YANASE, Mutsuyasu et al. (PATENT ATTORNEYS SHINPO, 8th Floor UK Building,1-32-14, Takadanobab, Shinjuku-ku Tokyo 75, 1690075, JP)
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