METHOD OF MAKING NONVOLATILE MEMORY CELL CONTAINING CARBON RESISTIVITY SWITCHING AS A STORAGE ELEMENT BY LOW TEMPERATURE

PROCESSING

CROSS REFERENCE TO RELATE PATENT APPLICATIONS

[0001] The present application claims benefit of United States provisional application 61/071 ,088, filed April 1 1, 2008, and United States application 12/222,341, filed August 7, 2008, both which are incorporated herein by reference in their entirety.

BACKGROUND OF THE INVENTION

[0002] The invention relates to a nonvolatile memory array.

[0003] Nonvolatile memory arrays maintain their data even when power to the device is turned off. In one-time programmable arrays, each memory cell is formed in an initial unprogrammed state, and can be converted to a programmed state. This change is permanent, and such cells are not erasable. In other types of memories, the memory cells are erasable, and can be rewritten many times.

[0004] Cells may also vary in the number of data states each cell can achieve. A data state may be stored by altering some characteristic of the cell which can be detected, such as current flowing through the cell under a given applied voltage or the threshold voltage of a transistor within the cell. A data state is a distinct value of the cell, such as a data '0' or a data T.

SUMMARY OF THE EMBODIMENTS

[0005] One embodiment of the invention provides a method of making a nonvolatile memory cell, comprising forming a steering element and forming a graphene storage element, wherein the step of forming the graphene storage element comprises providing a graphene colloid, and coating the graphene colloid over a substrate to form a graphene layer.

[0006] Another embodiment of the invention provides a method of making a nonvolatile memory cell, comprising forming a steering element and forming a carbon resistivity switching material storage element, wherein the step of forming the storage element comprises providing a graphene oxide colloid, coating the graphene oxide colloid over a

substrate to form a graphene oxide layer; and reducing the graphene oxide layer to a resistivity switching material layer comprising at least one of graphene, microcrystalline, nano crystalline, polycrystalline or amorphous carbon layer.

[0007] Another embodiment of the invention provides a method of making a nonvolatile memory device, comprising forming a steering element and forming a carbon resistivity switching material storage element wherein the step of forming the storage element comprises providing graphite flakes, chemically separating graphite flakes into carbon sheets comprising at least one of graphene, microcrystalline, nano crystalline, polycrystalline or amorphous carbon sheets, breaking the carbon sheets into carbon pieces to form a carbon colloid, and coating the carbon colloid over a substrate to form a resistivity switching material layer comprising at least one of graphene, microcrystalline, nanocrystalline, polycrystalline or amorphous carbon layer.

[0008] Another embodiment of the invention provides a method of making a nonvolatile memory cell, comprising forming a steering element, and forming a carbon resistivity switching material storage element, wherein the step of forming the storage element comprises providing a graphite source material, oxidizing the graphite source material to form graphite oxide, converting the graphite oxide to a graphene oxide colloid, reducing the graphene oxide colloid to a carbon colloid, and coating the carbon colloid over a substrate to form a resistivity switching material layer comprising at least one of graphene, microcrystalline, nanocrystalline, polycrystalline or amorphous carbon layer.

BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Fig. l is a perspective view of a memory cell formed according to a preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] In general, a memory cell comprises a storage element and a steering element. The steering element can be a diode or a transistor. Carbon materials have been observed to show resistive switching characteristics. Carbon resistivity switching materials, include but are not limited to graphene (such as one or more layers of graphene, which is a two-dimensional carbon nanostructure), microcrystalline, nanocrystalline, polycrystalline or amorphous

carbon. Such characteristics makes the carbon resistivity switching material, such as graphene, a candidate material for a storage element of the nonvolatile memory cell However, graphene films are usually deposited, for example by CVD methods, at high temperature (about 700-800 °C or higher). This high temperature process makes graphene incompatible with some steering elements, such as semiconductor diodes and transistors which cannot withstand such high temperatures If subjected to such a high temperature, the performance of a diode as a steenng element will degrade. For example, the reverse leakage current may increase significantly Similar performance degradations occur to field effect transistors.

[0011] By depositing carbon resistivity switching materials, such as graphene, at low temperature, including but not limited to room temperature processes, nonvolatile memory cells comprising a carbon resistivity switching material elements (such as graphene storage elements) can be produced without sacrificing the performance of the steenng element of the memory cell and the underlying CMOS transistors of the driver circuit located on the substrate In the following embodiments, graphene is described as the carbon resistivity switching material However, it should be understood that the carbon resistivity switching material may comprise one or more of microcrystalhne, nanocrystalline, polycrystalline or amorphous carbon, preferably but not necessaπly in flake form In other words, some or all of the carbon mateπal may not have a perfect graphene lattice structure, but instead may compπse microcrystalline, nanocrystalline, polycrystalline and/or amorphous carbon flakes.

[0012] One embodiment of the invention provides a method of making a nonvolatile memory cell, compπsing forming a steering element and forming a graphene storage element, wherein the step of forming the graphene storage element compπses providing graphene oxide, converting the graphene oxide into a graphene oxide colloid, reducing the graphene oxide colloid to a graphene colloid, and coating the graphene colloid over a substrate to form a graphene layer Alternatively, the graphene oxide can be converted to graphene after the colloid is deposited over the substrate

[0013] The colloid can be obtained from a graphite or graphene oxide source material. For example, the graphite oxide can be firstly obtained from graphite by a modified Hummers method as originally presented by Kovtyukhova and colleagues (Hummers et al., J Am Chem Soc. 80, 1339 (1958), and Kovtyukhova et al , Chem Mater 11, 771-778 (1999), and as descπbed in Li et al , Nature Nanotechnology, 3, 101-105 (2008)), which are all hereby

incorporated by reference. As-synthesized graphite oxide can be suspended in water to give a brown dispersion, which is subjected to dialysis to completely remove residual salts and acids. Ultrapure Milli-Q ^® water can be used. As-purified graphite oxide suspensions can be then dispersed in water to create an around 0.05 wt% dispersion. Exfoliation of graphite oxide to graphene oxide colloids can be achieved by ultrasonication of the dispersion using a Brandson Digital Sonifier (S450D, 500 W, 30% amplitude) for 30 min. In order to obtain graphene oxide colloid, the above obtained brown dispersion can be then subjected to 30 min of centrifugation at 3,000 r.p.m. to remove any unexfoliated graphite oxide (usually present in a very small amount) using an Eppendorf 5702 centrifuge with a rotor radius of 14 cm. The resulting homogeneous dispersion (5.0 ml) can be mixed with 5.0 ml of water, 5.0 μl of hydrazine solution (35 wt% in water, Aldrich) and 35.0 μl of ammonia solution (28 wt% in water, Crown Scientific) in a 20-ml glass vial to further obtain a grahene colloid. The weight ratio of hydrazine to graphene oxide can be about 7: 10. After being vigorously shaken or stirred for a few minutes, the vial can be put in a water bath (~95°C) for 1 h. The obtained graphene colloid can be sprayed or spin coated onto a surface to form a graphene layer. The graphene colloid can be coated over the steering element or under the steering element of the memory cell. As noted above, some or all graphene may be substituted with microcrystalline, nanocrystalline, polycrystalline and/or amorphous carbon flakes, depending on the processing conditions.

[0014] The concentration of hydrazine in the reduction mixture can be varied from 0.0175 wt% (used in the above procedure) to 1.75 wt%. In order to obtain stable dispersions when the concentration is greater than 0.0175 wt%, excess hydrazine in the resulting dispersions can be removed by dialysis against an around 0.5% ammonia solution once the reduction is complete. Reducing reagents and bases other than hydrazine and or ammonia can be also be used.

[0015] In another embodiment, the graphene oxide colloid can be spin on or sprayed onto a surface to form a graphene oxide layer. The formed graphene oxide layer can then be reduced to a graphene layer by hydrazine or other reducing reagents. The graphene oxide colloid can be coated over the steering element or under the steering element. As noted above, some or all graphene may be substituted with microcrystalline, nanocrystalline, polycrystalline and/or amorphous carbon flakes, depending on the processing conditions, such as on the reducing treatment.

[0016] In another embodiment, a graphene colloid can contain graphene pieces, obtained by chemically separating graphite flakes into graphene sheets followed by breaking the graphene sheets into graphene pieces to further form a colloid of graphene. As noted above, some or all graphene may be substituted with microcrystalline, nanocrystalline, polycrystalline and/or amorphous carbon flakes, depending on the processing conditions, such as the chemical and physical processing conditions. The obtained graphene colloid can be sprayed or spin coated onto a surface to form a graphene layer. The graphene colloid can be coated over the steering element or can be coated under the steering element. Exemplary methods of making a graphene colloid from graphite flakes can be found in U.S. Patent Number 3,404,061 and U.S. Patent Number 7,105,108; see also Science 22 October 2004, Vol. 306. no. 5696, pp. 666 - 669 (mechanical exfoliation of graphite to form graphene), which are all hereby incorporated by reference.

[0017] The steering element can be a transistor or a diode. If the steering element is a diode, the graphene layer as a storage element can be arranged vertically and/or horizontally and/or patterned to form a pillar or block having a substantially cylindrical shape. An adhesion layer, for example but not limited to titanium nitride, can be formed between the graphene layer and the steering element. Thermal anneal steps can be added if needed. Thickness of the graphene layer can be varied to a desirable range.

[0018] In preferred embodiments, the memory cell includes a cylindrical semiconductor diode is located in series with a cylindrical graphene layer or film. The diode and the film are disposed between two electrodes, as illustrated in Fig. 1. The number of graphene layers or films need not be limited to one; for example, it can be two or more. The diode and graphene film may have a shape other than cylindrical, if desired. For a detailed description of a the design of a memory cell comprising a diode as a steering element, see for example US Patent Application No. 11/125,939 filed on May 9, 2005 (which corresponds to US Published Application No. 2006/0250836 to Heraer et al.), and US Patent Application No 11/395,995 filed on March 31, 2006 (which corresponds to US Patent Published Application No. 2006/0250837 to Herner et al.,) each of which is hereby incorporated by reference. In the preferred embodiments of the invention, the graphene film serves as the resistivity switching element and the diode as the steering element of the memory cell.

[0019] For example, Fig. 1 illustrates the perspective view of a memory cell formed according to a preferred embodiment of the present invention. A bottom conductor 101 is

formed of a conductive material, for example tungsten, and extends in a first direction. Barrier and adhesion layers, such as TiN layers, maybe included in bottom conductor 101. The semiconductor diode 110 has a bottom heavily doped n-type region 112; an intrinsic region 114, which is not intentionally doped; and a top heavily doped p-type region 116, though the orientation of this diode may be reversed. Such a diode, regardless of its orientation, will be referred to as a p-i-n diode or simply diode. A graphene layer 118 is disposed on the diode, either on the top region 116 or below the bottom region 112 of the diode 110. Top conductor 100 may be formed in the same manner and of the same materials as bottom conductor 101, and extends in a second direction different from the first direction. The semiconductor diode 110 is vertically disposed between bottom conductor 101 and top conductor 100. The diode can comprise any single crystal, polycrystalline, or amorphous semiconductor material, such as silicon, germanium, or silicon-germanium alloys.

[0020] The resistivity of the graphene storage elements can be changed between stable states by applying appropriate electrical pulses. In the preferred embodiments, the set and reset transitions are performed with graphene under bias. More than one programming pulse can be used. For example, a plurality of bias pulses are applied to the cell to switch the resistivity of the graphene oxide layer.

[0021] The memory cell can be a read / write memory cell or a rewritable memory cell. The memory cell can be further located in a three dimensional array of memory cells.

[0022] Generally, a device for programming the memory cells is a driver circuit located under, over, or adjacent to the memory cell. The circuit can have a monolithic integrated structure, or a plurality of integrated device packaged together or in close proximity or die- bonded together. For a detailed descriptions of the driver circuit, see for example, US Patent Application No. 10/185,508 by Cleeves; US Patent Application No. 09/560,626 by Knall; and US Patent No. 6,055,180 to Gudensen et al., each of which is hereby incorporated by reference.

[0023] The above described memory cell may be located in a one memory level device. If desired, additional memory levels can be formed above the first memory level to form a monolithic three dimensional memory array. In some embodiments, conductors can be shared between memory levels; i.e. top conductor of one memory lever would serve as the bottom conductor of the next memory level. In other embodiments, an interlevel dielectric

can be formed above the first memory level, its surface planarized, and construction of a second memory level begins on this planarized interlevel dielectric, with no shared conductors.

[0024] The foregoing detailed description has described only a few of the many forms that this invention can take. For this reason, this detailed description is intended by way of illustration, and not by way of limitation. It is only the following claims, including all equivalents, which are intended to define the scope of this invention.