Title:
METHOD FOR MANUFACTURING 3DIC CHIP AND 3DIC CHIP
Document Type and Number:
WIPO Patent Application WO/2020/232678
Kind Code:
A1
Abstract:
The embodiments of the present application provide a method for manufacturing 3DIC chip and 3DIC chip, wherein the manufacturing method includes: detecting a first die wafer, and screening out the effective wafer in the first die wafer as a first wafer; preparing an interconnect layer on the surface of the first wafer; fixing a second wafer on the surface of the interconnect layer; the signal line is provided in the interconnect layer, the signal line is coupled with the first wafer and/or the second wafer. Using the above method to manufacture 3DIC chip can improve the product yield of 3DIC chip, and reduce the process cost of 3DIC chip.
Inventors:
GU SHIQUN (CN)
YIN XUEWU (CN)
WANG ZHENGBO (CN)
YIN XUEWU (CN)
WANG ZHENGBO (CN)
Application Number:
PCT/CN2019/088023
Publication Date:
November 26, 2020
Filing Date:
May 22, 2019
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01L21/60; H01L23/00; H01L25/00
Foreign References:
| CN106169459A | 2016-11-30 | |||
| CN107017171A | 2017-08-04 | |||
| CN107644870A | 2018-01-30 | |||
| CN107301957A | 2017-10-27 | |||
| CN107851615A | 2018-03-27 |
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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