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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING ANISOTROPIC CONDUCTIVE FILM, AND ANISOTROPIC CONDUCTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2017/191776
Kind Code:
A1
Abstract:
Provided is a method for manufacturing an anisotropic conductive film with which it is possible to reduce manufacturing costs. Also, provided is an anisotropic conductive film capable of suppressing the occurrence of conduction failure. The method for manufacturing the anisotropic conductive film has: a holding step for supplying conductive particles of a plurality of particle diameters (20a to 20c) on a member (10) which has a plurality of opening parts, and holding the conductive particles in the opening parts; and a transfer step for transferring the conductive particles held in the opening parts to an adhesive film. In the particle diameter distribution graph of the conductive particles held in the opening parts (X axis: particle diameter [µm], Y axis: number of particles), the shape of the graph is such that in the range of maximum peak particle diameter or greater, the slope is substantially infinite.

Inventors:
NISHIMURA JUNICHI (JP)
Application Number:
PCT/JP2017/016255
Publication Date:
November 09, 2017
Filing Date:
April 25, 2017
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
H01R43/00; H01B1/22; H01B5/16; H01B13/00; H01R11/01
Domestic Patent References:
WO2013005831A12013-01-10
Foreign References:
JP2014060151A2014-04-03
JP2013055045A2013-03-21
JP2013258136A2013-12-26
JP2008300360A2008-12-11
JP2015135748A2015-07-27
JP2007297636A2007-11-15
JP2010176910A2010-08-12
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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