Title:
METHOD FOR MANUFACTURING ARRAY SUBSTRATE, AND ARRAY SUBSTRATE AND DISPLAY APPARATUS
Document Type and Number:
WIPO Patent Application WO/2019/174333
Kind Code:
A1
Abstract:
A method for manufacturing an array substrate, and an array substrate and a display apparatus. The array substrate comprises a display region and a wiring region. The display region is disposed with a first thin-film transistor and a second thin-film transistor. The distance from a first active layer of the first-thin film transistor to a substrate is different from the distance of a second active layer of the second thin-film transistor to the substrate. The first thin-film transistor comprises a first via hole for accommodating a first source and drain electrode. The second thin-film transistor comprises a second via hole for accommodating a second source and drain electrode. The wiring region is disposed with a groove. The groove comprises a first sub-groove and a second sub-groove which are stacked. The method for manufacturing an array substrate comprises: simultaneously forming a first via hole and a first sub-groove, and simultaneously forming a second via hole and a second sub-groove.
Inventors:
YANG WEI (CN)
LU XINHONG (CN)
LU XINHONG (CN)
Application Number:
PCT/CN2018/120250
Publication Date:
September 19, 2019
Filing Date:
December 11, 2018
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
H01L21/77; H01L27/32
Foreign References:
CN108376672A | 2018-08-07 | |||
CN106876412A | 2017-06-20 | |||
CN107026178A | 2017-08-08 | |||
CN107731858A | 2018-02-23 | |||
CN106298648A | 2017-01-04 | |||
US20080297711A1 | 2008-12-04 |
Attorney, Agent or Firm:
CHINA PATENT AGENT (H.K.) LTD. (CN)
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