Title:
METHOD OF MANUFACTURING BAND BLADE, METHOD OF BENDING BAND PLATE MATERIAL AND APPARATUS FOR BENDING BAND PLATE MATERIAL
Document Type and Number:
WIPO Patent Application WO/1996/021543
Kind Code:
A1
Abstract:
The invention has its object to perform respective processings of forming notches and bends on a portion (62) being processed of a lengthy edged band plate material (61) with high precision. A bending device (31) and a notch forming device (11) are used such that the portion (62) being processed of the lengthy edged band plate material (61) which is passed through an outlet (35) of a die member (32) of the bending device (31) is subjected to notch-forming by the notch-forming device (11), then subjected to bending by the bending device (31) and is finally cut off from a portion which is not processed. When the edged band plate material (61) is pressed against a forming surface (36) of the outlet (35) of the stationary die member (32) by a pressing tool (33) to be bent, a pulled-out amount of the edged band plate material (61) is measured by an encoder (8). A servomotor (7) is operated a number of revolutions which corresponds to a measurement of the encoder (8) to rotate feed rollers (51) to feed the edged band plate material (61) by a predetermined amount.
Inventors:
MIZUKAWA SUEHIRO (JP)
Application Number:
PCT/JP1995/002747
Publication Date:
July 18, 1996
Filing Date:
December 27, 1995
Export Citation:
Assignee:
MIZUKAWA SUEHIRO (JP)
International Classes:
B26F1/00; B21D5/01; B21D5/04; B21D28/02; B21D35/00; B21D37/20; B21D53/00; B21D53/64; B26F1/44; (IPC1-7): B26F1/00; B21D5/01; B23P15/40; B26F1/44
Foreign References:
| JPH0780727A | 1995-03-28 | |||
| JPS58160024A | 1983-09-22 |
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