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Patent Searching and Data


Title:
METHOD OF MANUFACTURING BONDED BODY, TEMPORARY-FIXING MEMBER, AND STACKED BODY
Document Type and Number:
WIPO Patent Application WO/2019/163575
Kind Code:
A1
Abstract:
Provided are a method of manufacturing a bonded body in which positional error between electrically conductive members is suppressed and inhibition to bonding of the electrically conductive members is suppressed, a temporary-fixing member for use in the manufacture of the bonded body, and a stacked body. The method of manufacturing a bonded body comprises: a temporary-fixing step of providing a temporary-fixing member between at least two electrically conductive members having electrical conductivity to thereby temporarily fix the at least two electrically conductive members to each other; a removing step of removing the temporary-fixing member; and a bonding step of bonding the at least two electrically conductive members to each other. The temporary-fixing member is used for the method of manufacturing a bonded body. The stacked body comprises a stack in which a temporary-fixing member is provided between at least two electrically conductive members having electrical conductivity.

Inventors:
SAIE Toshiyuki (4000 Kawashiri, Yoshida-cho, Haibara-gu, Shizuoka 96, 〒4210396, JP)
YAMASHITA Kosuke (4000 Kawashiri, Yoshida-cho, Haibara-gu, Shizuoka 96, 〒4210396, JP)
HOTTA Yoshinori (4000 Kawashiri, Yoshida-cho, Haibara-gu, Shizuoka 96, 〒4210396, JP)
TONOHARA Koji (4000 Kawashiri, Yoshida-cho, Haibara-gu, Shizuoka 96, 〒4210396, JP)
KUROOKA Shunji (4000 Kawashiri, Yoshida-cho, Haibara-gu, Shizuoka 96, 〒4210396, JP)
Application Number:
JP2019/004765
Publication Date:
August 29, 2019
Filing Date:
February 12, 2019
Export Citation:
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Assignee:
FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome Minato-k, Tokyo 20, 〒1068620, JP)
International Classes:
H01L21/60; H01R11/01
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (6F FFTP M0 BLDG, 1250 Takematsu Minamiashigara-sh, Kanagawa 11, 〒2500111, JP)
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