Title:
METHOD FOR MANUFACTURING BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2019/187926
Kind Code:
A1
Abstract:
This method for manufacturing a bonded body has: a step in which a first member and a second member are stacked with a silver paste layer therebetween to obtain a laminate; a step in which the laminate is heated, thereby forming a porous silver sintered layer having in the interior thereof continuous pores with a pore diameter of 0.5 – 3.0 μm and having a porosity of 20% or greater; and a filling step in which the continuous pores of the porous silver sintered layer are filled with a resin. The silver past layer includes a solvent and silver particles, and in a volume-basis cumulative undersized particle size distribution the 50 volume% particle diameter D50 is 0.3 – 1.0 μm, and the ratio D90/D10 of the 90 volume% particle dimeter D90 to the 10 volume% particle diameter D10 is 5.0 – 10.
Inventors:
YAMASAKI KAZUHIKO (JP)
MASUYAMA KOTARO (JP)
YAMAGUCHI TOMOHIKO (JP)
HIGAMI AKIHIRO (JP)
MASUYAMA KOTARO (JP)
YAMAGUCHI TOMOHIKO (JP)
HIGAMI AKIHIRO (JP)
Application Number:
PCT/JP2019/007537
Publication Date:
October 03, 2019
Filing Date:
February 27, 2019
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
B22F7/08; B22F1/00; B22F3/26; H01B1/22
Foreign References:
| JP2012052198A | 2012-03-15 | |||
| JP2014051590A | 2014-03-20 | |||
| JP2012089512A | 2012-05-10 | |||
| JP2007016258A | 2007-01-25 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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