Title:
METHOD FOR MANUFACTURING BONDED STRUCTURE AND BONDED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/090392
Kind Code:
A1
Abstract:
This method for manufacturing a bonded structure is a method for manufacturing a bonded structure in which a metal member and a resin member have been bonded together, the metal member having a protrusion on a surface thereof, the method being provided with: a step of forming perforations having an opening in a bonding region of the protrusion; a step of making the resin member come in contact with the bonding region of the protrusion of the metal member under pressurization in a state in which the resin member is separated from the surface of the metal member; and a step of melting the resin member in contact with the bonding region of the metal member and solidifying the melted resin member after the perforations have become filled with the resin.
Inventors:
KAMIOKA WATARU (JP)
NISHIKAWA KAZUYOSHI (JP)
NISHIKAWA KAZUYOSHI (JP)
Application Number:
PCT/JP2016/082520
Publication Date:
June 01, 2017
Filing Date:
November 02, 2016
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO (JP)
International Classes:
B29C65/16; B23K26/324; B23K26/382; B23K26/57; B29C65/02
Foreign References:
| JP2015030260A | 2015-02-16 | |||
| JP2006015405A | 2006-01-19 |
Other References:
See also references of EP 3381660A4
Attorney, Agent or Firm:
ARC PATENT ATTORNEYS' OFFICE (JP)
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