Title:
METHOD FOR MANUFACTURING CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS, CARRIER FOR DOUBLE-SIDE POLISHING APPARATUS, AND METHOD FOR POLISHING DOUBLE SIDES OF WAFER
Document Type and Number:
WIPO Patent Application WO/2011/010423
Kind Code:
A1
Abstract:
Disclosed is a method for manufacturing a carrier for a double-side polishing apparatus which polishes the double sides of a wafer, said carrier being composed of: a carrier main body, which is disposed between upper and lower surface plates having polishing cloths respectively attached thereto, and which has a holding hole for holding a wafer to be sandwiched between the upper and lower surface plates at the time of polishing the wafer; and a ring-shaped resin insert, which is disposed along the inner circumference of the holding hole of the carrier main body, and has the inner circumferential surface to be in contact with the peripheral portion of the wafer to be held. In the method, at least the base material of the resin insert having no inner circumferential surface to be in contact with the wafer to be held is mounted in the holding hole of the carrier main body, then, process of forming the inner circumferential surface is performed to the base material of the resin insert, and the inner circumferential surface which is to be in contact with the peripheral portion of the wafer to be held is formed. Thus, the wafer can be processed to have a desired inner circumferential shape at a high accuracy by suppressing strain of the resin insert, and thinning of the outer circumference and nanotopological failures of the polished wafer can be suppressed.
Inventors:
YASUDA, Taichi (Shin-Etsu Handotai Co. Ltd., 6-2, Ohtemachi 2-chome, Chiyoda-k, Tokyo 04, 〒1000004, JP)
安田太一 (〒04 東京都千代田区大手町二丁目６番２号信越半導体株式会社 本社内 Tokyo, 〒1000004, JP)
安田太一 (〒04 東京都千代田区大手町二丁目６番２号信越半導体株式会社 本社内 Tokyo, 〒1000004, JP)
Application Number:
JP2010/004077
Publication Date:
January 27, 2011
Filing Date:
June 18, 2010
Export Citation:
Assignee:
Shin-Etsu Handotai Co., Ltd. (6-2 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
信越半導体株式会社 (〒04 東京都千代田区大手町二丁目６番２号 Tokyo, 〒1000004, JP)
YASUDA, Taichi (Shin-Etsu Handotai Co. Ltd., 6-2, Ohtemachi 2-chome, Chiyoda-k, Tokyo 04, 〒1000004, JP)
信越半導体株式会社 (〒04 東京都千代田区大手町二丁目６番２号 Tokyo, 〒1000004, JP)
YASUDA, Taichi (Shin-Etsu Handotai Co. Ltd., 6-2, Ohtemachi 2-chome, Chiyoda-k, Tokyo 04, 〒1000004, JP)
International Classes:
B24B37/04; H01L21/304
Attorney, Agent or Firm:
YOSHIMIYA, Mikio (1st Shitaya Bldg. 8F, 6-11 Ueno 7-chome, Taito-k, Tokyo 05, 〒1100005, JP)