Title:
METHOD FOR MANUFACTURING CARRIER FOR DUAL-SURFACE POLISHING DEVICE, AND METHOD FOR POLISHING DUAL SURFACES OF WAFER
Document Type and Number:
WIPO Patent Application WO/2017/159213
Kind Code:
A1
Abstract:
The present invention provides a method for manufacturing a carrier for dual-surface polishing devices, the method characterized by comprising: a preparing step for preparing a carrier base material and an insertion material having a larger thickness than the carrier base material; a step for fitting the insertion material into a holding hole such that the insertion material protrudes from both the obverse surface side and the reverse surface side of the carrier base material; a measuring step for measuring the obverse-surface-side protrusion amount of the insertion material protruding from the obverse surface side of the carrier base material, and the reverse-surface-side protrusion amount of the insertion material protruding from the reverse surface side of the carrier base material; a setting step for setting the rotation speeds, at the time of arranging and polishing of a carrier, of an upper lapping plate and a lower lapping plate, respectively, such that the difference between the obverse-surface-side protrusion amount and the reverse-surface-side protrusion amount becomes small; and an arranging-and-polishing step for arranging and polishing the carrier in accordance with the rotation speeds respectively set for the upper lapping plate and the lower lapping plate. Accordingly, the present invention provides: the method for manufacturing the carrier for dual-surface polishing devices, the method enabling improvement in the flatness of an edge section of a wafer of which dual surfaces have been polished; and a method for polishing dual surfaces of a wafer.
Inventors:
KITAZUME DAICHI (JP)
TANAKA YUKI (JP)
TANAKA YUKI (JP)
Application Number:
PCT/JP2017/005950
Publication Date:
September 21, 2017
Filing Date:
February 17, 2017
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
International Classes:
B24B37/08; B24B37/28; H01L21/304
Foreign References:
| JP2009202259A | 2009-09-10 | |||
| JP2014176954A | 2014-09-25 | |||
| JP2015174168A | 2015-10-05 | |||
| JP2016198864A | 2016-12-01 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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