Title:
METHOD FOR MANUFACTURING CARRIER TAPE FOR ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2018/221277
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a carrier tape for electronic components, said method making it possible to effectively eliminate the risk of damage to projecting parts of semiconductor packages or other electronic components. This manufacturing method involves: holding a softened resin sheet between an upper die 2 and a lower die 3 of a mold; hot-press molding a bottomed, low-profile rectangular-tube-shaped accommodating emboss that accommodates a semiconductor package; and forming a position-restricting projection spanned by the lead frame of the semiconductor package between a bottom plate of the accommodating emboss and a raised-bottom seat plate. In the lower die 3, a molding rib 30 for the position-restricting projection is formed so as to project in a tapering manner, and a distal-end part 31 thereof is curved into a rounded shape, thereby reducing the wall thickness of the distal-end part of the position-restricting projection and minimizing the width of the position-restricting projection. Because the width of the position-restricting projection can be reduced to a narrow form, it is possible to eliminate the risk that the lead frame will be easily deformed and damaged due to pressure contact between the position-restricting projection of the accommodating emboss and the lower part of the lead frame of the semiconductor package.
Inventors:
AIZAWA JUNICHI (JP)
Application Number:
PCT/JP2018/019381
Publication Date:
December 06, 2018
Filing Date:
May 18, 2018
Export Citation:
Assignee:
SHINETSU POLYMER CO (JP)
International Classes:
B65B15/04; B29C59/02; B65D85/86
Foreign References:
| JP2011240945A | 2011-12-01 | |||
| JP2003146363A | 2003-05-21 | |||
| JPH08207132A | 1996-08-13 | |||
| JPH07195553A | 1995-08-01 |
Attorney, Agent or Firm:
FUJIMOTO Eisuke et al. (JP)
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