METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD

WIPO Patent Application WO/2017/003128

A1

The present invention relates to a method for manufacturing a ceramic circuit board and, more specifically, to a method for manufacturing a ceramic circuit board in which a circuit pattern is formed through printing. The method for manufacturing a ceramic circuit board according to the present invention comprises the steps of: a) forming a titanium (Ti) thin film layer on a ceramic board; b) forming a copper (Cu) thin film layer on the titanium (Ti) thin film layer; c) forming a copper (Cu) pattern layer on the copper (Cu) thin film layer by performing, at least once, a step of printing a copper (Cu) pattern on the copper (Cu) thin film layer, by using a copper paste, and then drying the copper (Cu) pattern; d) sintering the copper (Cu) pattern layer; e) removing the copper (Cu) thin film layer of a portion in which the copper (Cu) pattern layer is not formed; and f) removing the titanium (Ti) thin film layer of the portion in which the copper (Cu) pattern layer is not formed. The method for manufacturing a ceramic circuit board, according to the present invention, can easily manufacture a ceramic circuit board having an excellent coupling force between a metal pattern and the ceramic board.

KIM MIN SOO (KR)
KIM SANG JOO (KR)
KIM BYEONG GIL (KR)

PCT/KR2016/006668

January 05, 2017

June 23, 2016

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COMETNETWORK CO LTD (KR)

H05K3/38; H05K1/03; H05K3/06; H05K3/10

JPH10107392A	1998-04-24
JP2002280709A	2002-09-27
JP2000272977A	2000-10-03
KR20130015878A	2013-02-14
KR940703939A	1994-12-12

DYNE PATENT & LAW FIRM (KR)

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