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Title:
METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2018/135499
Kind Code:
A1
Abstract:
Disclosed is a method for manufacturing a ceramic circuit board provided with a ceramic base material and a metal layer formed on the ceramic base material. This method is provided with a step for forming the metal layer on the ceramic base material by spraying a metal powder after acceleration to a speed of 250 – 1050 m/s along with heating to 10 – 270°C, and a step for heat treatment of the ceramic base material and metal layer in an inert gas atmosphere.

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Inventors:
SAKAKI KAZUHIKO (JP)
SAKAI ATSUSHI (JP)
YAMADA SUZUYA (JP)
TANIGUCHI YOSHITAKA (JP)
Application Number:
PCT/JP2018/001054
Publication Date:
July 26, 2018
Filing Date:
January 16, 2018
Export Citation:
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Assignee:
UNIV SHINSHU (JP)
DENKA COMPANY LTD (JP)
International Classes:
C23C24/04; H05K3/10
Domestic Patent References:
WO2016056567A12016-04-14
Foreign References:
JP2006089290A2006-04-06
JP2013067825A2013-04-18
JPH07193358A1995-07-28
JPH08208359A1996-08-13
JP2001085808A2001-03-30
Other References:
See also references of EP 3572555A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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