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Title:
METHOD FOR MANUFACTURING CERAMIC COVERING MEMBER FOR SEMICONDUCTOR PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2007/108548
Kind Code:
A1
Abstract:
An object of the present invention is to improve the durability of a member provided within a vessel, for example, in a semiconductor processing apparatus which conducts plasma etching under a strongly corrosive environment. The object can be attained by manufacturing a ceramic covering member for a semiconductor processing apparatus by thermally spraying a group IIIa oxide on a surface of a metallic or nonmetallic base material either directly or through an undercoat layer to form a layer formed of porous layer, and applying a high level of energy such as electron beams or laser beams onto the surface of the layer to form a secondary recrystallized layer.

Inventors:
HARADA, Yoshio (8-18, Takaoka 1-chome Okubo-cho, Akashi-sh, Hyogo 57, 6740057, JP)
原田良夫 (〒57 兵庫県明石市大久保町高丘1丁目8番18号 Hyogo, 6740057, JP)
TAKEUCHI, Junichi (706 5-12, Honjo-cho 2-chome Higashinada-ku, Kobe-sh, Hyogo 12, 6580012, JP)
竹内純一 (〒12 兵庫県神戸市東灘区本庄町2丁目5番12号706 Hyogo, 6580012, JP)
Application Number:
JP2007/056122
Publication Date:
September 27, 2007
Filing Date:
March 16, 2007
Export Citation:
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Assignee:
TOCALO CO., LTD. (13-4, Fukae-kitamachi 4-chome Higashinada-ku, Kobe-sh, Hyogo 13, 6580013, JP)
トーカロ株式会社 (〒13 兵庫県神戸市東灘区深江北町4丁目13番4号 Hyogo, 6580013, JP)
HARADA, Yoshio (8-18, Takaoka 1-chome Okubo-cho, Akashi-sh, Hyogo 57, 6740057, JP)
原田良夫 (〒57 兵庫県明石市大久保町高丘1丁目8番18号 Hyogo, 6740057, JP)
TAKEUCHI, Junichi (706 5-12, Honjo-cho 2-chome Higashinada-ku, Kobe-sh, Hyogo 12, 6580012, JP)
International Classes:
C23C28/04; C23C4/10; C23C4/18; C23C26/00; C23C28/00; H01L21/3065
Attorney, Agent or Firm:
OGAWA, Junzo et al. (Kobikikan Ginza Bldg, 8-9 Ginza 2-chome, Chuo-k, Tokyo 61, 1040061, JP)
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