Title:
METHOD FOR MANUFACTURING CERAMIC COVERING MEMBER FOR SEMICONDUCTOR PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2007/108548
Kind Code:
A1
Abstract:
An object of the present invention is to improve the durability of a member provided
within a vessel, for example, in a semiconductor processing apparatus which
conducts plasma etching under a strongly corrosive environment. The object
can be attained by manufacturing a ceramic covering member for a semiconductor
processing apparatus by thermally spraying a group IIIa oxide on a surface of
a metallic or nonmetallic base material either directly or through an undercoat
layer to form a layer formed of porous layer, and applying a high level of energy
such as electron beams or laser beams onto the surface of the layer to form a secondary
recrystallized layer.
Inventors:
HARADA YOSHIO (JP)
TAKEUCHI JUNICHI (JP)
YAMASAKI RYO (JP)
KOBAYASHI KEIGO (JP)
TAKEUCHI JUNICHI (JP)
YAMASAKI RYO (JP)
KOBAYASHI KEIGO (JP)
Application Number:
PCT/JP2007/056122
Publication Date:
September 27, 2007
Filing Date:
March 16, 2007
Export Citation:
Assignee:
TOCALO CO LTD (JP)
HARADA YOSHIO (JP)
TAKEUCHI JUNICHI (JP)
YAMASAKI RYO (JP)
KOBAYASHI KEIGO (JP)
HARADA YOSHIO (JP)
TAKEUCHI JUNICHI (JP)
YAMASAKI RYO (JP)
KOBAYASHI KEIGO (JP)
International Classes:
C23C28/04; C23C4/10; C23C4/18; C23C26/00; C23C28/00; H01L21/3065
Foreign References:
| JP2005256098A | 2005-09-22 | |||
| JP2001164354A | 2001-06-19 | |||
| JPS62253758A | 1987-11-05 | |||
| JPH04276059A | 1992-10-01 | |||
| JPS58192661A | 1983-11-10 | |||
| JP2002080954A | 2002-03-22 |
Attorney, Agent or Firm:
OGAWA, Junzo et al. (8-9 Ginza 2-chome, Chuo-k, Tokyo 61, JP)
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