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Title:
METHOD OF MANUFACTURING CERAMIC MULTI-LAYER SUBSTRATE, AND UNBAKED COMPOSITE LAMINATED BODY
Document Type and Number:
WIPO Patent Application WO/2002/043455
Kind Code:
A1
Abstract:
A method of manufacturing a ceramic multi-layer substrate, comprising a first process for manufacturing an unbaked composite laminated body (11) having a first contraction suppressing layer (13) and a second contraction suppressing layer (14) on one principal plane and the other principal plane of an unbaked multi-layer collecting substrate (12) formed of a plurality of ceramic green layers (17) stacked each other, a second process for forming cut-in grooves (16) reaching a part of the multi-layer collecting substrate (12) from the first contraction suppressing layer (13) side through the first contraction suppressing layer (13), a third process for baking the composite laminated body (11), a fourth process for removing the first and second contraction suppressing layers (13) and (14) and taking out the baked multi-layer collecting substrate (11), and a fifth process for taking out a plurality of ceramic multi-layer substrates by dividing the multi-layer collecting substrate along the cut-in grooves (16), whereby the ceramic multi-layer substrate with high dimensional accuracy and high reliability can be provided with high productivity by suppressing the contraction thereof in flat surface direction at the time of baking.

Inventors:
SAITOH YOSHIFUMI (JP)
KAWAKAMI HIROMICHI (JP)
Application Number:
PCT/JP2001/010200
Publication Date:
May 30, 2002
Filing Date:
November 22, 2001
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
SAITOH YOSHIFUMI (JP)
KAWAKAMI HIROMICHI (JP)
International Classes:
B28B11/24; B28B17/00; B32B18/00; C04B35/638; H01L21/48; H01L23/15; B32B37/00; H05K1/03; H05K3/00; H05K3/46; (IPC1-7): H05K3/46; B28B11/00; B32B18/00; H01L23/12; H05K3/00
Foreign References:
JP2000315841A2000-11-14
JPH1154886A1999-02-26
JPH07240571A1995-09-12
JPH1075060A1998-03-17
JPH0786743A1995-03-31
Other References:
See also references of EP 1272020A4
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