Title:
METHOD FOR MANUFACTURING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2024/005103
Kind Code:
A1
Abstract:
Provided is a method for manufacturing a circuit board (1) provided with an insulating layer (3), the method comprising a step for forming a via hole (4) by irradiating the circuit board (1) with an excimer laser having a pulse width of 30 microseconds or less and an output of 300 mJ/cm2 or greater.
Inventors:
KOH MEITEN (JP)
YONEDA KAZUYOSHI (JP)
NAKADA KAZUTAKA (JP)
YONEDA KAZUYOSHI (JP)
NAKADA KAZUTAKA (JP)
Application Number:
PCT/JP2023/024049
Publication Date:
January 04, 2024
Filing Date:
June 28, 2023
Export Citation:
Assignee:
TAIYO HOLDINGS CO LTD (JP)
International Classes:
H05K3/00
Foreign References:
| JP2009538539A | 2009-11-05 | |||
| JPH05185269A | 1993-07-27 | |||
| JPH03502075A | 1991-05-16 |
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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