Title:
METHOD OF MANUFACTURING CIRCUIT BOARDS
Document Type and Number:
WIPO Patent Application WO/2017/201294
Kind Code:
A3
Abstract:
Methods for manufacturing electrical circuits on laminates from low profile copper layers where one or more of the circuits have known and reproducible signal losses. The method for manufacturing printed circuit boards (40) comprising the steps of: providing a planar sheet (16) including a planar dielectric material layer having a first planar surface and a second planar surface, and first copper foil sheet (10) having a first planar surface and a second planar surface wherein the first copper foil planar surface is associated with the first dielectric material layer planar surface and wherein the first copper foil sheet first surface and second surface each include a bond enhancement layer (12, 14); and forming a circuit pattern (32, 34, 36) in the first planar copper sheet by removing unnecessary portions of the first planar copper sheet while leaving the circuit pattern copper in place to form an inner layer sheet including a circuit pattern wherein a bond enhancement layer is not applied to the circuit pattern after forming the circuit pattern.
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Inventors:
GAY MICHAEL (US)
Application Number:
PCT/US2017/033342
Publication Date:
December 28, 2017
Filing Date:
May 18, 2017
Export Citation:
Assignee:
ISOLA USA CORP (US)
GAY MICHAEL (US)
GAY MICHAEL (US)
International Classes:
H05K3/38; H05K1/02; H05K3/02; H05K3/46
Foreign References:
| US20050067378A1 | 2005-03-31 | |||
| US20110088933A1 | 2011-04-21 | |||
| EP1011299A2 | 2000-06-21 | |||
| EP0756443A1 | 1997-01-29 | |||
| US6964884B1 | 2005-11-15 |
Attorney, Agent or Firm:
HUGHES, A., Blair (US)
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