METHOD FOR MANUFACTURING COIL, COIL, AND ELECTRONIC DEVICE

WIPO Patent Application WO/2019/041366

A1

Disclosed are a method for manufacturing a coil, a coil, and an electronic device, the manufacturing method comprising the steps of: bonding a first side of a metal sheet (3) onto a laser-transmitting substrate (1) by means of an adhesive layer (2); cutting a coil pattern (30) on a second side of the metal sheet (3) by means of a laser to form a coil (31) running across the metal sheet (3) on two sides thereon; bonding the second side of the metal sheet (3) onto an adhesive tape (4), and then making the laser be transmitted through the laser-transmitting substrate (1) and act on the adhesive layer (2) to make the laser-transmitting substrate (1) and the adhesive layer (2) be separated from the first side of the metal sheet (3) and to expose the coil pattern (30) on the first side of the metal sheet (3); and forming an encapsulation layer (6) on the coil (31) to encapsulate the area, on the first side, of the coil (31). The metal sheet is cut by means of a laser, such that a coil having a small size and a regular profile can be produced, and the laser-transmitting substrate is adopted as a manufactured substrate, such that the laser-transmitting substrate is easier to remove by means of subsequent laser degumming or laser stripping, thereby avoiding the deformation of the coil.

ZOU QUANBO (CN)
WANG ZHE (CN)
SONG QINGLIN (CN)
SUN DEBO (CN)

PCT/CN2017/100546

March 07, 2019

September 05, 2017

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GOERTEK INC (CN)

H01F41/04

CN106129047A	2016-11-16
CN104519666A	2015-04-15
CN104465418A	2015-03-25
CN104992908A	2015-10-21
US20110047793A1	2011-03-03

BEYOND TALENT PATENT AGENT FIRM (CN)

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