Title:
METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE, AND COMPOSITE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/255376
Kind Code:
A1
Abstract:
The present invention facilitates the removal of substrates from a composite substrate and suppresses the peeling of the composite substrate in an unintended step. This method for manufacturing a composite substrate includes: forming a first adhesion material on a first surface of a first substrate; forming, on the first surface, at least one depression positioned inside of outer edge sections in the plan view of the first substrate; forming the first adhesion material on the inside walls of the depressions; forming a second adhesion material on a second surface of a second substrate without filling in the spaces surrounded by the inside walls of the depressions; and adhering the first adhesion material and the second adhesion material together in regions excluding the depressions.
Inventors:
NISHIMURA KUNIHIKO (JP)
NAKAMURA KEISUKE (JP)
FUJIKAWA MASAHIRO (JP)
HIZA SHUICHI (JP)
SHINAGAWA TOMOHIRO (JP)
YAGYU EIJI (JP)
NAKAMURA KEISUKE (JP)
FUJIKAWA MASAHIRO (JP)
HIZA SHUICHI (JP)
SHINAGAWA TOMOHIRO (JP)
YAGYU EIJI (JP)
Application Number:
PCT/JP2019/024725
Publication Date:
December 24, 2020
Filing Date:
June 21, 2019
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L21/02; B23K20/00; H01L27/12; H01L29/80
Foreign References:
| JP2016171307A | 2016-09-23 | |||
| JP2016509372A | 2016-03-24 | |||
| JP2003257805A | 2003-09-12 | |||
| JPH0661340A | 1994-03-04 | |||
| JP2008181990A | 2008-08-07 | |||
| JP2015522213A | 2015-08-03 |
Other References:
See also references of EP 3989263A4
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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