Title:
METHOD FOR MANUFACTURING CONDUCTING WIRE FRAME BODY AND CONDUCTING WIRE FRAME BODY
Document Type and Number:
WIPO Patent Application WO/2016/008360
Kind Code:
A1
Abstract:
A conducting wire frame body and a manufacturing method therefor. The method comprises the following key steps: preparing a bottom wire arrangement frame (1100), a top fixed frame, separation plates (121, 122) and conducting wires (131); executing a plate laying step (1200): laying the separation plates at the two ends of the bottom wire arrangement frame (1100); executing a wire arrangement step (1300): arranging a layer of unidirectional conducting wires (131) on the separation plates (121, 122) at a set interval; repeating the plate laying step and the wire arrangement step, so as to manufacture a set number of layers of unidirectional conducting wires; and installing the top fixed frame, so that unidirectionally arranged conducting wire pattern arrays manufactured through the plate laying step and the wire arrangement step are fixed in the two frames, thereby manufacturing a conducting wire frame body. The conducting wire frame body can be used for further manufacturing a conducting wire base material integrator and a substrate containing a conductive through hole.
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Inventors:
SHEN YUCI (US)
Application Number:
PCT/CN2015/082696
Publication Date:
January 21, 2016
Filing Date:
June 29, 2015
Export Citation:
Assignee:
SHEN YUCI (US)
International Classes:
H01L21/768; H01L23/48; H01L23/495
Foreign References:
| CN104183545A | 2014-12-03 | |||
| CN1820368A | 2006-08-16 | |||
| CN103745972A | 2014-04-23 | |||
| JP5490949B1 | 2014-05-14 |
Attorney, Agent or Firm:
YUHONG INTELLECTUAL PROPERTY LAW FIRM (CN)
北京聿宏知识产权代理有限公司 (CN)
北京聿宏知识产权代理有限公司 (CN)
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