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Title:
METHOD FOR MANUFACTURING CONDUCTIVE COATING FILM AND CONDUCTIVE COATING FILM
Document Type and Number:
WIPO Patent Application WO/2012/157701
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a conductive coating film which is formed on a polyimide based insulating substrate using metal powder paste and which has good conductivity and adhesiveness with the insulating substrate. After a resin curing layer having 20 or less % by weight of soluble fraction content and thickness of 5 μm or less is provided on the polyimide based insulating substrate and a metal powder-containing coating film is formed thereon using the metal powder paste, heat treatment with superheated steam takes place. Thereby, a conductive coating film having good conductivity and good adhesiveness with the insulating substrate can be obtained.

Inventors:
YATSUKA TAKESHI (JP)
ITO CHIHO (JP)
KAKIHARA YASUO (JP)
KIZUMOTO HIROTOSHI (JP)
SHOKI KOJI (JP)
Application Number:
PCT/JP2012/062649
Publication Date:
November 22, 2012
Filing Date:
May 17, 2012
Export Citation:
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Assignee:
TODA KOGYO CORP (JP)
TOYO BOSEKI (JP)
YATSUKA TAKESHI (JP)
ITO CHIHO (JP)
KAKIHARA YASUO (JP)
KIZUMOTO HIROTOSHI (JP)
SHOKI KOJI (JP)
International Classes:
C09D201/00; B32B15/088; C08J7/043; C08J7/044; C09D5/24; C09D7/61; H01B5/14; H01B13/00
Foreign References:
JP2006062135A2006-03-09
JP2004171658A2004-06-17
JPH07242833A1995-09-19
JPH0873812A1996-03-19
JP2011082145A2011-04-21
JP2011093297A2011-05-12
JP2010199285A2010-09-09
Attorney, Agent or Firm:
OKADA, KAZUHIKO (JP)
Kazuhiko Okada (JP)
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Claims:



 
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