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Patent Searching and Data


Title:
METHOD OF MANUFACTURING CONDUCTIVE FILM FOR TOUCH PANEL SENSOR, CONDUCTIVE FILM FOR TOUCH PANEL SENSOR, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2016/158419
Kind Code:
A1
Abstract:
The present invention provides a method of manufacturing a conductive film for a touch panel sensor having a transparent electrode, a conductive film for a touch panel sensor, and a touch panel, having excellent adhesion between the transparent electrode and lead-out wiring, and wherein the lead-out wiring exhibits excellent conductive properties. The method for manufacturing a conductive film for a touch panel sensor according to the present invention comprises: a step A for forming, on a substrate, a layer for the formation of a plated layer; a step B for exposing areas, on the layer for formation of a plated layer, where lead-out wiring is to be formed, and forming a patterned plated layer; a step C for forming lead-out wiring on the patterned plated layer; a step D for forming a transparent conductive film on the substrate so as to overlap with at least one end of the lead-out wiring; a step E for forming a resist pattern at predetermined positions on the transparent conductive film; a step F for removing, by an etching process, the transparent conductive film at areas where the resist pattern is not provided, and forming a transparent electrode; and a step G for removing the resist pattern.

Inventors:
HIGASHI KOHEI (JP)
TSUKAMOTO NAOKI (JP)
Application Number:
PCT/JP2016/058329
Publication Date:
October 06, 2016
Filing Date:
March 16, 2016
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G06F3/041
Foreign References:
JP2014178465A2014-09-25
JP2013149196A2013-08-01
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
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