Title:
METHOD FOR MANUFACTURING CONNECTED BODY, ANISOTROPIC BONDING FILM, AND CONNECTED BODY
Document Type and Number:
WIPO Patent Application WO/2020/090684
Kind Code:
A1
Abstract:
Provided are a method for manufacturing a connected body that is capable of bonding electronic components having fine-pitch electrodes, an anisotropic bonding film, and a connected body. An anisotropic bonding material which comprises solder particles, a flux compound, and at least one solid resin selected from among a thermoplastic resin, a solid radically polymerizable resin, and a solid epoxy resin that are solid at normal temperature and have a melt flow rate of 10 g/10 min or more measured under the condition of a temperature of 190°C and a load of 2.16 kg is interposed between an electrode of a first electronic component and an electrode of a second electronic component in a thickness that is 50 to 300% of the average particle size of the solder particles, and the electrode of the first electronic component and the electrode of the second electronic component are heat-bonded with no load.
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Inventors:
ISHIMATSU TOMOYUKI (JP)
ABE TOMOYUKI (JP)
AOKI MASAHARU (JP)
ABE TOMOYUKI (JP)
AOKI MASAHARU (JP)
Application Number:
PCT/JP2019/042035
Publication Date:
May 07, 2020
Filing Date:
October 25, 2019
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01R11/01; C08K3/08; C08K5/09; C08L101/00; H01L21/60; H01L33/62
Domestic Patent References:
| WO2007020764A1 | 2007-02-22 |
Foreign References:
| JP2004140366A | 2004-05-13 | |||
| JP2007157820A | 2007-06-21 | |||
| JP2007232627A | 2007-09-13 |
Attorney, Agent or Firm:
NOGUCHI, Nobuhiro (JP)
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