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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2015/004698
Kind Code:
A1
Abstract:
 This method for manufacturing a connector comprises a first step for producing a contact body including a plurality of contact pins arranged in a row at a predetermined pitch and a second step for mounting the contact body in an insulating housing, wherein the first step comprises a first substep for readying a mold in which an inverted pattern of the contact body is engraved on the surface, a second substep for performing first electroplating to fill the region in which the inverted pattern is formed and forming a conductor film, and a third substep for extracting the conductor film from the mold and forming the contact body.

Inventors:
TERADA TOKINORI (JP)
SANO TAKASHI (JP)
Application Number:
PCT/JP2013/004301
Publication Date:
January 15, 2015
Filing Date:
July 11, 2013
Export Citation:
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Assignee:
LEAP CO LTD (JP)
International Classes:
H01R43/16; H01R43/18
Domestic Patent References:
WO2013072954A12013-05-23
WO2013072952A12013-05-23
Foreign References:
JPH0193077A1989-04-12
Attorney, Agent or Firm:
HAGIHARA, MAKOTO (JP)
Makoto Hagiwara (JP)
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