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Title:
METHOD OF MANUFACTURING CUT FILM
Document Type and Number:
WIPO Patent Application WO/2020/090502
Kind Code:
A1
Abstract:
This method of manufacturing a cut film comprises obtaining a cut film by cutting a film to be cut including a thermoplastic resin layer with a laser beam having a wavelength of 360 nm or less, wherein the film to be cut has an absorbance of 0.10 or more at the wavelength of the laser beam.

Inventors:
MIURA TAKUYA (JP)
Application Number:
PCT/JP2019/040927
Publication Date:
May 07, 2020
Filing Date:
October 17, 2019
Export Citation:
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Assignee:
ZEON CORP (JP)
International Classes:
G02B5/30; B23K26/38
Foreign References:
JP2016057403A2016-04-21
JP2016055348A2016-04-21
JP2019098400A2019-06-24
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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