Title:
METHOD FOR MANUFACTURING CYLINDRICAL SPUTTERING TARGET
Document Type and Number:
WIPO Patent Application WO/2020/195787
Kind Code:
A1
Abstract:
A method for manufacturing a cylindrical sputtering target, the method comprising a backing treatment step of applying a bonding material for backing treatment use onto at least one member selected from an inner peripheral surface of a cylindrical target material and an outer peripheral surface of a cylindrical backing tube to form a first backing treatment layer having a thickness of 0.1 to 0.8 mm inclusive and a bonding step of, subsequent to the backing treatment step, inserting the cylindrical backing tube into the cylindrical target material and then filling a bonding material for filling use in a molten state into the gap space between the cylindrical target material and the cylindrical backing tube, wherein the first backing treatment layer is scratched on at least the surface thereof in the backing treatment step, and the inserted product is heated until the first backing treatment layer becomes in a semi-molten state in at least the surface thereof and then the bonding material for filling use is filled in the bonding step.
Inventors:
OKANO SHIN (JP)
OHTOMO TAKESHI (JP)
OHTOMO TAKESHI (JP)
Application Number:
PCT/JP2020/010271
Publication Date:
October 01, 2020
Filing Date:
March 10, 2020
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C23C14/34
Foreign References:
| JP2018178251A | 2018-11-15 | |||
| JP2018168417A | 2018-11-01 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
Download PDF:
Previous Patent: COLOR CONVERSION SUBSTRATE AND DISPLAY USING SAME
Next Patent: ELECTROMECHANICAL UNIT
Next Patent: ELECTROMECHANICAL UNIT