Title:
METHOD FOR MANUFACTURING DISPLAY DEVICE, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/026155
Kind Code:
A1
Abstract:
In the present invention, a part of a resin film is accurately cut out at the time of peeling the resin film. A resin film (11) is peeled from a glass substrate (61) by applying a laser beam (63) to the rear surface of the glass substrate (61) on which a protruding section (62) is formed. At that time, the protruding section (62) and the resin film 11 formed on the protruding section (62) are left on the glass substrate (61).
Inventors:
OKABE TOHRU
GUNJI RYOSUKE
TANIYAMA HIROKI
SAIDA SHINSUKE
ICHIKAWA SHINJI
INOUE AKIRA
JINMURA HIROHARU
NAKADA YOSHIHIRO
GUNJI RYOSUKE
TANIYAMA HIROKI
SAIDA SHINSUKE
ICHIKAWA SHINJI
INOUE AKIRA
JINMURA HIROHARU
NAKADA YOSHIHIRO
Application Number:
PCT/JP2017/027767
Publication Date:
February 07, 2019
Filing Date:
July 31, 2017
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
G09F9/00; G09F9/30; H01L21/02; H01L21/67; H01L27/12; H01L27/32; H01L51/50; H05B33/02; H05B33/10
Domestic Patent References:
| WO2016046997A1 | 2016-03-31 | |||
| WO2012046428A1 | 2012-04-12 |
Foreign References:
| JP2013135181A | 2013-07-08 | |||
| JP2013135180A | 2013-07-08 | |||
| JP2013026546A | 2013-02-04 | |||
| JP2014086451A | 2014-05-12 | |||
| JP2015037075A | 2015-02-23 | |||
| US20100203296A1 | 2010-08-12 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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