Title:
METHOD FOR MANUFACTURING EL DEVICE, EL DEVICE, APPARATUS FOR MANUFACTURING EL DEVICE, AND MOUNTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2018/158841
Kind Code:
A1
Abstract:
Disclosed is a method for manufacturing an EL device that is provided with a base layer (7), a light emitting element layer, a plurality of terminals (TM), and an electronic circuit board (60) that is mounted on the terminals. In the method, a preparation step for directly or indirectly applying, to a predetermined region (PB) including the terminals, heat and pressure without having the terminals and the electronic circuit board overlapping each other is performed, then, a thermocompression bonding step for bonding the terminals (TM) and the electronic circuit board (60) to each other by means of thermocompression bonding is performed.
Inventors:
NAKAYAMA MASAKI
Application Number:
PCT/JP2017/007893
Publication Date:
September 07, 2018
Filing Date:
February 28, 2017
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
H05B33/10; G09F9/00; G09F9/30; H01L51/50; H05B33/02; H05B33/06; H05B33/14
Domestic Patent References:
| WO2013099135A1 | 2013-07-04 |
Foreign References:
| JP2011134627A | 2011-07-07 | |||
| JP2015121777A | 2015-07-02 | |||
| JP2004281182A | 2004-10-07 | |||
| JP2012178262A | 2012-09-13 | |||
| JP2015232660A | 2015-12-24 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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