Title:
METHOD FOR MANUFACTURING ELASTIC BOUNDARY WAVE APPARATUS, AND ELASTIC BOUNDARY WAVE APPARATUS
Document Type and Number:
WIPO Patent Application WO/2007/055080
Kind Code:
A1
Abstract:
This invention provides a method for manufacturing an elastic boundary wave
apparatus in which an external terminal in an elastic boundary wave element and
a part for electrically connecting the external terminal to the external are
reliably reinforced, and, at the same time, the entry of moisture and the like
through the interface of the first and second media in the elastic boundary wave
element is less likely to take place. This method comprises the steps of providing
a curing resin sheet in which at least one via hole electrode (20a, 20b) is provided
so as to extend from one main plane to the other main plane, providing an elastic
boundary wave element (10) provided on one main plane of the curing resin sheet
so that the external terminals (16a, 16b) in the elastic boundary wave element
(10) are electrically connected to the via hole electrodes (20a, 20b), then pushing
the elastic boundary wave element (10) into the curing resin sheet so that the
curing resin sheet covers at least a part, which appears on the outer surface of
the boundary between the first and second media (11, 12) in the elastic boundary
wave element (10), and then curing the curing resin sheet to prepare a resin sheet
cured product (18).
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Inventors:
ODA TETSUYA (JP)
Application Number:
PCT/JP2006/320279
Publication Date:
May 18, 2007
Filing Date:
October 11, 2006
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
ODA TETSUYA (JP)
ODA TETSUYA (JP)
International Classes:
H03H3/08; H03H9/25
Foreign References:
JP2004159262A | 2004-06-03 | |||
JP2004007051A | 2004-01-08 | |||
JP2001332654A | 2001-11-30 |
Attorney, Agent or Firm:
MIYAZAKI, Chikara (5-4 Tanimachi 1-chome, Chuo-k, Osaka-shi Osaka, JP)
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