Title:
METHOD FOR MANUFACTURING ELASTIC WAVE ELEMENT AND ELASTIC WAVE ELEMENT
Document Type and Number:
WIPO Patent Application WO/2023/058713
Kind Code:
A1
Abstract:
A method for manufacturing an elastic wave element according to the present disclosure includes a support substrate, a piezoelectric layer provided on the support substrate, and a functional electrode provided on the piezoelectric layer, the support substrate being provided with a cavity at a position that overlaps a part of the functional electrode in the lamination direction of the support substrate and the piezoelectric layer. The method for manufacturing the elastic wave element includes: preparing a wafer; affixing the wafer to a dicing tape; dicing the wafer to fragment the elastic wave element; abutting at least one pin against the elastic wave element with the dicing tape interposed therebetween to separate the elastic wave element from the dicing tape; and, picking up the elastic wave element. The position at which the at least one pin is abutted against the elastic wave element is disposed at a position different from that of the cavity in the lamination direction.
Inventors:
JONOSONO SHINYA (JP)
Application Number:
PCT/JP2022/037439
Publication Date:
April 13, 2023
Filing Date:
October 06, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H3/02; H03H9/25; H03H9/64
Domestic Patent References:
| WO2021060512A1 | 2021-04-01 | |||
| WO2020130128A1 | 2020-06-25 |
Foreign References:
| US20200403600A1 | 2020-12-24 | |||
| JP2009225256A | 2009-10-01 | |||
| JP2010165963A | 2010-07-29 | |||
| JP2016100729A | 2016-05-30 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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