Title:
METHOD FOR MANUFACTURING ELASTIC WAVE ELEMENT AND ELASTIC WAVE ELEMENT
Document Type and Number:
WIPO Patent Application WO/2023/140270
Kind Code:
A1
Abstract:
A method for manufacturing an elastic wave element according to the present disclosure is for manufacturing an elastic wave element that includes a support substrate, a piezoelectric layer provided on the support substrate, and a functional electrode provided on the piezoelectric layer, the support substrate being provided with a cavity at a position that overlaps a part of the functional electrode in the lamination direction of the support substrate and the piezoelectric layer. The method for manufacturing the elastic wave element includes: preparing a wafer; affixing the wafer to a dicing tape; dicing the wafer to fragment the elastic wave element; abutting at least one pin against the elastic wave element with the dicing tape interposed therebetween to separate the elastic wave element from the dicing tape; and picking up the elastic wave element. The position at which the at least one pin is abutted against the elastic wave element is disposed at a position overlapping that of the cavity in the lamination direction.
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Inventors:
JONOSONO SHINYA (JP)
YAMANE TAKASHI (JP)
YAMANE TAKASHI (JP)
Application Number:
PCT/JP2023/001275
Publication Date:
July 27, 2023
Filing Date:
January 18, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H3/08; H03H9/64
Domestic Patent References:
| WO2016103925A1 | 2016-06-30 |
Foreign References:
| JP2015119219A | 2015-06-25 | |||
| JP2015204531A | 2015-11-16 | |||
| US20210408994A1 | 2021-12-30 | |||
| JP2018019286A | 2018-02-01 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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